Fine pattern compatible high joint reliability electroless nickel/gold plating process
An electroless nickel/gold plating process with excellent fine patterning, ideal for plating on fine wiring.
As electronic devices become lighter, thinner, smaller, and more functional, there is a demand for finer patterns on semiconductor package substrates that incorporate semiconductor components. Our company has developed a new electroless nickel/gold plating process that supports fine patterns, reducing the occurrence of voids and pinholes while ensuring high connection reliability.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
